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| d a t a sh eet product speci?cation supersedes data of 2002 apr 10 2004 mar 31 integrated circuits tda3681 multiple voltage regulator with switch and ignition buffer
2004 mar 31 2 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 features general extremely low noise behaviour and good stability with very small output capacitors second supply pin for regulators 3 and 4 to reduce power dissipation (e.g. via a dc-to-dc converter) three v p -state controlled regulators (regulators 1, 3 and 4) and a power switch regulator 2, reset and ignition buffer operational during load dump and thermal shutdown combined control pin for switching regulators 1 and 3 separate control pins for switching regulator 4 and the power switch supply voltage range from - 18 to +50 v low quiescent current in standby mode (when regulators 1, 3 and 4 and power switch are switched off and ignition input is low) hold output (open-collector output stage) for low v p (regulators 1, 3 and 4 and power switch off) hold output when one of regulators 1 and 3 and/or 4 is out of regulation hold output for foldback mode of power switch and regulators 1, 3 and 4 hold output for load dump and temperature protection reset (push-pull output stage) for regulator 2 adjustable reset delay time high supply voltage ripple rejection backup capacitor for regulator 2 one independent ignition buffer (active high). protections reverse polarity safe (down to - 18 v without high reverse current) able to withstand voltages up to 18 v at the outputs (supply line may be short-circuited) esd protection on all pins thermal protections load dump protection foldback current limit protection for regulators 1, 2, 3 and 4 delayed second current limit protection for the power switch (at short-circuit) the regulator outputs and the power switch are dc short-circuit safe to ground and supply (v p ). general description the tda3681 is a multiple output voltage regulator with a power switch and an ignition buffer. it is intended for use in car radios with or without a microcontroller. the tda3681 contains the following: four fixed voltage regulators with a foldback current protection (regulators 1, 2, 3 and 4). regulator 2, which is intended to supply a microcontroller, also operates during load dump and thermal shutdown regulators 3 and 4 have a second supply pin that can be connected to a lower supply voltage (>6.5 v) to reduce the power dissipation a power switch with protection, operated by a control input reset and hold outputs that can be used to interface with the microcontroller; the reset signal can be used to call up the microcontroller both supply pins can withstand load dump pulses and negative supply voltages regulator 2, which is in regulation at a backup voltage above 6.5 v a provision for the use of a reserve supply capacitor that will hold enough energy for regulator 2 (5 v continuous) to allow a microcontroller to prepare for loss of voltage an ignition input schmitt trigger with push-pull output stage. ordering information type number package name description version tda3681j dbs17p plastic dil-bent-sil power package; 17 leads (lead length 7.7 mm) sot243-3 tda3681jr dbs17p plastic dil-bent-sil (special bent) power package; 17 leads (lead length 12 mm) sot475-1 tda3681th hsop20 plastic, heatsink small outline package; 20 leads; low stand-off height sot418-3 2004 mar 31 3 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 quick reference data symbol parameter conditions min. typ. max. unit supplies v p1 supply voltage 1 operating 9.5 14.4 18 v reverse polarity non-operating -- 18 v regulator 2 on 4 14.4 50 v jump start t 10 minutes -- 30 v load dump protection t 50 ms; t r 3 2.5 ms -- 50 v v p2 supply voltage 2 operating 6.5 14.4 18 v reverse polarity non-operating -- 18 v regulator 2 on 0 - 50 v jump start t 10 minutes -- 30 v load dump protection t 50 ms; t r 3 2.5 ms -- 50 v i q(tot) total quiescent supply current standby mode - 110 150 m a t j junction temperature -- 150 c voltage regulators v o(reg1) output voltage of regulator 1 1 ma i reg1 600 ma; v p = 14.4 v 8.0 8.5 9.0 v v o(reg2) output voltage of regulator 2 1 ma i reg2 300 ma; v p = 14.4 v 4.75 5.0 5.25 v v o(reg3) output voltage of regulator 3 1 ma i reg3 1400 ma; v p = 14.4 v 4.75 5.0 5.25 v v o(reg4) output voltage of regulator 4 1 ma i reg4 1 a; v p = 14.4 v 3.14 3.3 3.46 v power switch v drop(sw) drop-out voltage i sw = 1 a; v p1 = 13.5 v - 0.45 0.65 v i sw = 1.8 a; v p1 = 13.5 v - 1.0 1.8 v i m(sw) peak current 3 -- a 2004 mar 31 4 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 block diagrams mgl902 regulator 2 regulator 4 regulator 1 16 14 7 + temperature load dump protection 17 11 9 3 10 8 13 power switch backup switch backup control & & & & or gnd (14.4 v) tda3681j tda3681jr res reg2 reg4 reg1 (14 v/ 3 a) (14 v/ 100 ma) (5 v/ 300 ma) (3.3 v/ 1 a) (8.5 v/ 600 ma) sw v p1 ensw en4 v p2 en1/3 c res bu hold 12 1 ignition buffer 5 ign out ign in 6 4 regulator 3 & reg3 (5 v/ 1400 ma) 2 15 fig.1 block diagram of tda3681j and tda3681jr. 2004 mar 31 5 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 mgu353 regulator 2 regulator 4 regulator 1 16 13 4 + temperature load dump protection 14 8 6 20 7 5 10 power switch backup switch backup control & & & & or gnd (14.4 v) tda3681th res reg2 reg4 reg1 (14 v/ 3 a) (14 v/ 100 ma) (5 v/ 300 ma) (3.3 v/ 1 a) (8.5 v/ 600 ma) sw v p1 ensw en4 11 heattab n.c. n.c. 15 18 v p2 en1/3 c res bu hold 9 17 ignition buffer 2 ign out ign in 3 1 regulator 3 & reg3 (5 v/ 1400 ma) 19 12 fig.2 block diagram of tda3681th. 2004 mar 31 6 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 pinning pin description of tda3681j and tda3681jr note 1. the heat tab is internally connected to pin gnd. symbol pin description reg1 1 regulator 1 output reg3 2 regulator 3 output v p2 3 second supply voltage reg4 4 regulator 4 output ign in 5 ignition input ign out 6 ignition output (active high) res 7 reset output (active low) c res 8 reset delay capacitor en4 9 enable input for regulator 4 en1/3 10 enable input for regulators 1 and 3 ensw 11 enable input for power switch hold 12 hold output (active low) gnd 13 ground; note 1 bu 14 backup switch output reg2 15 regulator 2 output sw 16 power switch output v p1 17 supply voltage handbook, halfpage tda3681j tda3681jr mgl903 v p2 reg1 reg3 reg4 ign in ign out c res en4 res en1/3 ensw hold gnd bu reg2 sw v p1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 fig.3 pin configuration for tda3681j and tda3681jr. 2004 mar 31 7 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 pin description of tda3681th note 1. the pin is used for final test purposes. in the application it should be connected directly to ground. symbol pin description reg4 1 regulator 4 output ign in 2 ignition input ign out 3 ignition output (active high) res 4 reset output (active low) c res 5 reset delay capacitor en4 6 enable input for regulator 4 en1/3 7 enable input for regulators 1 and 3 ensw 8 enable input for power switch hold 9 hold output (active low) gnd 10 ground heattab 11 heat tab connection; note 1 reg2 12 regulator 2 output bu 13 backup switch output v p1 14 supply voltage n.c. 15 not connected sw 16 power switch output reg1 17 regulator 1 output n.c. 18 not connected reg3 19 regulator 3 output v p2 20 second supply voltage handbook, halfpage tda3681th mgu329 1 2 3 4 5 6 7 8 9 10 reg4 ign in ign out res c res en4 en1/3 ensw hold gnd v p2 reg3 n.c. reg1 sw n.c. v p1 bu reg2 heattab 20 19 18 17 16 15 14 13 12 11 fig.4 pin configuration for tda3681th. 2004 mar 31 8 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 functional description the tda3681 is a multiple output voltage regulator with a power switch, intended for use in car radios with or without a microcontroller. because of the low voltage operation of the car radio, low voltage drop regulators are used. regulator 2 is in regulation when the backup voltage exceeds 6.5 v for the first time. when regulator 2 is switched on and its output voltage is within its voltage range, the reset output is disabled to release the microcontroller. the reset delay time before release can be extended by an external capacitor (c res ). this start-up feature is included to secure a smooth start-up of the microcontroller at first connection, without uncontrolled switching of regulator 2 during the start-up sequence. the charge on the backup capacitor can be used to supply regulator 2 for a short period when the external supply voltage drops to 0 v (the time depends on the value of the backup capacitor). the output stages of all switchable regulators have an extremely low noise behaviour and good stability, even for small values of the output capacitors. when both regulator 2 and the supply voltages (v p1 and v p2 > 4.5 v) are available, regulators 1 and 3 can be operated by means of one enable input. regulator 4 and the power switch have a separate enable input. pin hold is normally high but is active low. pin hold is connected to an open-collector npn transistor and must have an external pull-up resistor to operate. the hold output is controlled by a low voltage detection circuit which, when activated, pulls the hold output low (enabled). the hold outputs of the regulators are connected to an or gate inside the ic so that the hold circuit is activated when one or more regulators (1, 3 or 4) are out of regulation for any reason. each regulator enable input controls its own hold triggering circuit, so that if a regulator is disabled or switched off, the hold circuit for that regulator is disabled. the hold circuit is also controlled by the temperature and load dump protection. activating the temperature or load dump protection causes a hold (low) during the time that the protection is activated. when all regulators are switched off, the hold output is controlled by the battery line v p1 , temperature protection and load dump protection. the hold circuit is enabled at low battery voltages. this indicates that it is not possible to get regulator 1 into regulation when switching it on: regulator 1 has the highest output voltage (8.5 v) of all switchable regulators. therefore, regulator 1 is the most critical regulator with respect to an out of regulation condition caused by a low battery voltage. the hold function includes hysteresis to avoid oscillations when the regulator voltage crosses the hold threshold level. the hold output also becomes active when the power switch is in foldback protection mode; see fig.8. the block diagram of the hold function is illustrated in fig.5. all output pins are fully protected. the regulators are protected against load dump (regulators 1, 3 and 4 switch off at supply voltages >18 v) and short-circuit (foldback current protection). the power switch contains a current protection. however, this protection is delayed at short-circuit by the reset delay capacitor (it should be noted that this is the second function of the reset delay capacitor c res ). during this time, the output current is limited to a peak value of at least 3 a (after a delay, the power switch can deliver 1.8 a continuous if v p 18 v). in a normal situation, the voltage on the reset delay capacitor is approximately 3.5 v (depending on the temperature). the power switch output is approximately v p - 0.4 v. at operating temperature, the power switch can deliver at least 3 a. at high temperature, the switch can deliver approximately 2 a. during an overload condition or a short circuit (v sw 2004 mar 31 9 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 handbook, full pagewidth & or or regulator 3 low battery detector internal voltage reference 1 enable output stage output stage enable output of regulation detector output of regulation detector regulator 4 tda3681 temperature protection load dump buffer mgl904 power switch foldback mode en1/3 reg3 reg4 hold v p1 en4 reg1 regulator 1 internal voltage reference 2 enable output stage output of regulation detector fig.5 block diagram of the hold circuit. 2004 mar 31 10 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 load dump load dump v bu regulator 2 reset reset delay capacitor ignition input ignition output 5.0 v 5.0 v 5.4 v 6.5 v 3.0 v 0 v 0 v 5.0 v 5.0 v 50 v 0 v 0 v - 100 v back-up schmitt trigger and reset behaviour enable schmitt trigger ignition hold behaviour v p1 = v p2 v p1 = v p2 v p1 enable regulator 1/3 enable regulator 4 regulator 1 and 3 regulator 4 temperature protection 150 c hold >1.8 v <1.3 v low high passive active >1.8 v <1.3 v mgl905 >22 v fig.6 timing diagram of ignition schmitt triggers and hold circuit. 2004 mar 31 11 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 handbook, full pagewidth v p1 = v p2 enable regulator 1/3 regulator 1 enable regulator 4 regulator 3 v p enable power switch power switch output 18 v 8.9 v 7.0 v 4.0 v 3 1.8 v > 1.8 v < 1.3 v > 1.8 v < 1.3 v 8.5 v 0 v load dump regulator 4 3.3 v 0 v 5.0 v 0 v 16.9 v 7.0 v 4.0 v 16 v 0 v 1.3 v load dump mgl906 power switch behaviour v p and enable schmitt trigger fig.7 timing diagram of regulators and power switch. 2004 mar 31 12 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 limiting values in accordance with the absolute maximum rating system (iec 60134). thermal characteristics quality specification in accordance with general quality specification for integrated circuits (snw-fq-611d) . symbol parameter conditions min. max. unit v p1 supply voltage 1 operating - 18 v reverse polarity non-operating - 18 v jump start t 10 minutes - 30 v load dump protection t 50 ms; t r 3 2.5 ms - 50 v v p2 supply voltage 2 operating - 18 v reverse polarity non-operating - 18 v jump start t 10 minutes - 30 v load dump protection t 50 ms; t r 3 2.5 ms - 50 v p tot total power dissipation - 62 w t stg storage temperature non-operating - 55 +150 c t amb ambient temperature operating - 40 +85 c t j junction temperature operating - 40 +150 c symbol parameter conditions value unit r th(j-c) thermal resistance from junction to case 1.3 k/w r th(j-a) thermal resistance from junction to ambient in free air 50 k/w 2004 mar 31 13 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 characteristics v p =v p1 =v p2 = 14.4 v; t amb =25 c; measured in test circuits of figs 10 and 11; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supplies v p1 supply voltage 1 operating 9.5 14.4 18 v reverse polarity non-operating -- 18 v regulator 2 on note 1 4 14.4 50 v jump start t 10 minutes -- 30 v load dump protection t 50 ms; t r 3 2.5 ms -- 50 v v p2 supply voltage 2 operating 6.5 14.4 18 v reverse polarity non-operating -- 18 v regulator 2 on 0 - 50 v jump start t 10 minutes -- 30 v load dump protection t 50 ms; t r 3 2.5 ms -- 50 v v bat(loaddump) battery overvoltage shutdown v p1 and/or v p2 18 20 22 v i q(tot) total quiescent supply current v p = 12.4 v; note 2 - 105 145 m a v p = 14.4 v; note 2 - 110 150 m a schmitt trigger for power supply (regulators 1, 3 and 4) v th(r) rising threshold voltage v p1 rising 6.5 7.0 7.5 v v th(f) falling threshold voltage v p1 falling 4.0 4.5 5.0 v v hys hysteresis voltage - 2.5 - v schmitt trigger for enable input (regulators 1, 3, 4 and power switch) v th(r) rising threshold voltage 1.4 1.8 2.4 v v th(f) falling threshold voltage 0.9 1.3 1.9 v v hys hysteresis voltage i reg =i sw =1ma - 0.5 - v i li input leakage current v en =5v 1 5 20 m a reset trigger level of regulator 2 v th(r) rising threshold voltage v p1 rising; i reg2 =50ma; note 3 4.43 v reg2 - 0.15 v reg2 - 0.1 v v th(f) falling threshold voltage v p1 falling; i reg2 =50ma; note 3 4.4 v reg2 - 0.25 v reg2 - 0.13 v schmitt triggers for hold circuit output v th(r)(reg1) rising threshold voltage of regulator 1 v p1 rising; note 3 - v reg1 - 0.15 v reg1 - 0.075 v v th(f)(reg1) falling threshold voltage of regulator 1 v p1 falling; note 3 7.67 v reg1 - 0.35 - v v hys(reg1) hysteresis voltage due to regulator 1 - 0.2 - v 2004 mar 31 14 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 v th(r)(reg3) rising threshold voltage of regulator 3 v p2 rising; note 3 - v reg3 - 0.15 v reg3 - 0.075 v v th(f)(reg3) falling threshold voltage of regulator 3 v p2 falling; note 3 4.3 v reg3 - 0.35 - v v hys(reg3) hysteresis voltage due to regulator 3 - 0.2 - v v th(r)(reg4) rising threshold voltage of regulator 4 v p2 rising; note 3 - v reg4 - 0.15 v reg4 - 0.075 v v th(f)(reg4) falling threshold voltage of regulator 4 v p2 falling; note 3 2.7 v reg4 - 0.3 - v v hys(reg4) hysteresis voltage due to regulator 4 - 0.15 - v v th(r)(vp) rising threshold voltage of supply voltage v en = 0 v 9.1 9.7 10.3 v v th(f)(vp) falling threshold voltage of supply voltage v en = 0 v 9.0 9.4 9.8 v v hys(vp) hysteresis voltage of supply voltage v en =0v - 0.3 - v reset and hold buffer i sink(l) low-level sink current v res 0.8 v; v hold 0.8 v 2 -- ma i lo output leakage current v p2 = 14.4 v; v hold =5v - 0.1 5 m a i source(h) high-level source current v p2 = 14.4 v; v res 3 4.5 v 240 400 900 m a t r rise time note 4 - 750 m s t f fall time note 4 - 150 m s reset delay i ch reset delay capacitor charge current v cres =0v 2 4 8 m a i dch reset delay capacitor discharge current v cres =3v; v p1 =v p2 = 4.3 v 1.0 1.6 - ma v th(r)(res) rising voltage threshold reset signal 2.5 3.0 3.5 v v th(f)(res) falling voltage threshold reset signal 1.0 1.2 1.4 v t d(res) delay reset signal c res = 47 nf; note 5 20 35 70 ms t d(sw) delay power switch foldback protection c res = 47 nf; note 6 8 17.6 40 ms regulator 1 (i reg1 = 5 ma; unless otherwise speci?ed) v o(off) output voltage off - 1 400 mv v o(reg1) output voltage 1 ma i reg1 600 ma 8.0 8.5 9.0 v 9.5 v v p1 18 v 8.0 8.5 9.0 v d v line line regulation 9.5 v v p1 18 v - 275mv d v load load regulation 1 ma i reg1 600 ma - 20 85 mv symbol parameter conditions min. typ. max. unit 2004 mar 31 15 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 i q quiescent current i reg1 = 600 ma - 25 60 ma svrr supply voltage ripple rejection f i = 3 khz; v i = 2 v (p-p) 60 70 - db v drop(reg1) drop-out voltage i reg1 = 550 ma; v p1 = 8.55 v; note 7 - 0.4 0.7 v i m(reg1) current limit v reg1 > 7 v; note 8 0.65 1.2 - a i sc(reg1) short-circuit current r l 0.5 w ; note 9 250 800 - ma regulator 2 (i reg2 = 5 ma; unless otherwise speci?ed) v o(reg2) output voltage 0.5 ma i reg2 300 ma 4.75 5.0 5.25 v 7v v p1 18 v 4.75 5.0 5.25 v 18 v v p1 50 v; i reg2 150 ma 4.75 5.0 5.25 v d v line line regulation 6 v v p1 18 v - 250mv 6v v p1 50 v - 15 75 mv d v load load regulation 1 ma i reg2 150 ma - 20 50 mv 1ma i reg2 300 ma -- 100 mv svrr supply voltage ripple rejection f i = 3 khz; v i = 2 v (p-p) 50 55 - db v drop(reg2) drop-out voltage i reg2 = 100 ma; v p1 = 4.75 v; note 7 - 0.4 0.6 v i reg2 = 200 ma; v p1 = 5.75 v; note 7 - 0.8 1.2 v i reg2 = 100 ma; v bu = 4.75 v; note 10 - 0.2 0.5 v i reg2 = 200 ma; v bu = 5.75 v; note 10 - 0.8 1.0 v i m(reg2) current limit v reg2 > 4.5 v; note 8 0.32 0.37 - a i sc(reg2) short-circuit current r l 0.5 w ; note 9 95 120 - ma regulator 3 (i reg3 = 5 ma; unless otherwise speci?ed) v o(off) output voltage off - 1 400 mv v o(reg3) output voltage 1 ma i reg3 1400 ma 4.75 5.0 5.25 v 7v v p1 and/or v p2 18 v 4.75 5.0 5.25 v d v line line regulation 7 v v p1 and/or v p2 18 v - 250mv d v load load regulation 1 ma i reg3 1400 ma - 20 150 mv i q quiescent current i reg3 = 1400 ma - 19 45 ma svrr supply voltage ripple rejection f i = 3 khz; v i = 2 v (p-p) 60 70 - db v drop(reg3) drop-out voltage i reg3 = 1400 ma ; v p2 =6v; note 7 - 1 1.5 v i m(reg3) current limit v reg3 > 4.5 v; note 8 1.5 1.7 - a i sc(reg3) short-circuit current r l 0.5 w ; note 9 430 750 - ma symbol parameter conditions min. typ. max. unit 2004 mar 31 16 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 regulator 4 (i reg4 = 5 ma; unless otherwise speci?ed) v o(off) output voltage off - 1 400 mv v o(reg4) output voltage 1 ma i reg4 1 a 3.14 3.3 3.46 v 6.5 v v p1 and/or v p2 18 v 3.14 3.3 3.46 v d v line line regulation 6.5 v v p1 and/or v p2 18 v - 250mv d v load load regulation 1 ma i reg4 1a - 20 50 mv i q quiescent current i reg4 =1a - 15 40 ma svrr supply voltage ripple rejection f i = 3 khz; v i = 2 v (p-p) 60 70 - db v drop(reg4) drop-out voltage i reg4 = 1 a; v p2 = 5 v; note 7 - 1.7 2.4 v i m(reg4) current limit v reg4 > 3.0 v; note 8 1.1 1.5 - a i sc(reg4) short-circuit current r l 0.5 w ; note 9 470 750 - ma power switch v drop(sw) drop-out voltage i sw = 1 a; v p1 = 13.5 v; note 11 - 0.45 0.65 v i sw = 1.8 a; v p1 = 13.5 v; note 11 - 1.0 1.8 v i dc(sw) continuous current v p1 =16v; v sw = 13.5 v 1.8 2.0 - a v clamp(sw) clamping voltage v p1 3 17 v; 1ma 5 v 0.3 0.35 - a v clamp(bu) clamping voltage v p1 3 16.7 v; i reg2 = 100 ma -- 16 v i r(bu) reverse current v p1 =0v; v bu = 12.4 v -- 900 m a schmitt trigger for enable ignition input v th(r)(ignin) rising threshold voltage of ignition input v p1 > 3.5 v 1.9 2.2 2.5 v v th(f)(ignin) falling threshold voltage of ignition input v p1 > 3.5 v 1.7 2.0 2.3 v v hys(ignin) hysteresis voltage v p > 3.5 v 0.1 0.2 0.5 v i li input leakage current v ignin =5v -- 1.0 m a i i(clamp) input clamp current v ignin 50 v -- 50 ma v ih(clamp) high-level input clamping voltage v p1 - 50 v v il(clamp) low-level input clamping voltage v ignin 3- 100 v - 0.6 - 0v symbol parameter conditions min. typ. max. unit 2004 mar 31 17 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 notes 1. minimum operating voltage, only if v p1 has exceeded 6.5 v. 2. the total quiescent current is measured in the standby mode. therefore, the enable inputs of regulators 1, 3, 4 and the power switch are grounded and r l(reg2) = ; see figs 10 and 11. 3. the voltage of the regulator drops as a result of a v p1 drop for regulators 1 and 2. regulators 3 and 4 drop as a result of v p2 drop. 4. the rise and fall times are measured with a 10 k w pull-up resistor and a 50 pf load capacitor. 5. the delay time depends on the value of the reset delay capacitor: 6. the delay time depends on the value of the reset delay capacitor: 7. the drop-out voltage of regulators 1 and 2 is measured between pins v p1 and regn. the drop-out voltage of regulators 3 and 4 is measured between pins v p2 and regn. 8. at current limit, i m(regn) is held constant (see fig.8). 9. the foldback current protection limits the dissipated power at short-circuit (see fig.8). 10. the drop-out voltage is measured between pins bu and reg2. 11. the drop-out voltage of the power switch is measured between pins v p1 and sw. 12. the maximum output current of the power switch is limited to 1.8 a when the supply voltage exceeds 18 v. 13. at short-circuit, i sc(sw) of the power switch is held constant to a lower value than the continuous current after a delay of at least 10 ms. ignition buffer v ol low-level output voltage i ignout = 0 ma 0 0.2 0.8 v v oh high-level output voltage i ignout = 0 ma 4.5 5.0 5.25 v i ol low-level sink current v ignout 0.8 v 0.45 0.8 - ma i oh high-level source current v ignout 3 4.5 v 0.45 2.0 - ma t plh low-to-high propagation time v ignin rising from 1.7 to 2.5 v -- 500 m s t phl high-to-low propagation time v ignin falling from 2.5 to 1.7 v -- 500 m s temperature protection t j(sd) junction temperature for shutdown 150 160 170 c t j(hold) junction temperature for hold trigger 150 160 170 c symbol parameter conditions min. typ. max. unit t d(res) c i ch ------ v c(th) c 750 10 3 () s [] == t d(sw) c i ch ------ v c(th) c 375 10 3 () s [] = = 2004 mar 31 18 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 handbook, halfpage mgl908 5.0 v i sc(reg2) i reg2 v o(reg2) i m(reg2) handbook, halfpage mgl909 5.0 v i sc(reg3) i reg3 v o(reg3) i m(reg3) handbook, halfpage mgl910 3.3 v i sc(reg4) i reg4 v o(reg4) i m(reg4) fig.8 foldback current protection of the regulators. a. regulator 1. b. regulator 2. c. regulator 3. d. regulator 4. handbook, halfpage mgl907 8.5 v i sc(reg1) i m(reg1) i reg1 v o(reg1) handbook, full pagewidth > 1.8 a > 3 a 1 a generates hold mgr931 v p - 3.3 v 2v be i sw v sw not delayed delayed fig.9 current protection of the power switch. 2004 mar 31 19 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 test and application information test information mgl911 enable input regulator 4 supply voltage 2 regulator 4 output c3 10 m f c2 10 m f c1 220 nf c7 220 nf c4 10 m f hold output ignition output r l(reg2) 5 k w r l(sw) 12 k w 5 v 5 v 8.5 v regulator 3 output regulator 1 output regulator 2 output c5 10 m f c9 50 pf c12 50 pf r l(reg1) 10 k w r l(reg3) 5 k w 3.3 v c6 10 m f r l(reg4) 5 k w power switch output 16 15 1 12 6 reset output 7 4 2 9 3 8 11 17 (1) (1) (2) (3) (3) 13 tda3681j tda3681jr ground v p1 supply voltage 1 v ensw v en4 enable input regulator 1/3 enable input power switch 10 v en1/3 reset delay capacitor ignition input 10 k w r6 c11 1 nf backup 5 14 v ignin c10 100 m f v bu v p2 c8 47 nf r3 10 k w c13 1000 m f c14 1000 m f c15 100 nf c16 100 nf c17 100 nf c18 100 nf c19 100 nf fig.10 test circuit of tda3681j and tda3681jr. (1) a minimum capacitor of 220 nf on the supply lines v p1 and v p2 is required for stability. (2) a minimum capacitor of 1 m f for backup supply is required for stability. (3) capacitor represents the typical input capacitance of cmos logic connected to the reset and hold outputs. 2004 mar 31 20 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 mgu355 enable input regulator 4 supply voltage 2 regulator 4 output c3 10 m f c2 10 m f c1 220 nf c7 220 nf c4 10 m f hold output ignition output r l(reg2) 5 k w r l(sw) 12 k w 5 v 5 v 8.5 v regulator 3 output regulator 1 output regulator 2 output c5 10 m f c9 50 pf c12 50 pf r l(reg1) 10 k w r l(reg3) 5 k w 3.3 v c6 10 m f r l(reg4) 5 k w power switch output 16 12 17 9 3 reset output 4 1 19 6 20 5 8 14 (1) (1) (2) (3) (3) 10 tda3681th ground v p1 supply voltage 1 v ensw v en4 enable input regulator 1/3 enable input power switch 7 v en1/3 reset delay capacitor ignition input 10 k w r6 c11 1 nf backup 2 13 v ignin c10 100 m f v bu v p2 c8 47 nf r3 10 k w c13 1000 m f c14 1000 m f 11 heat tab c15 100 nf c16 100 nf c17 100 nf c18 100 nf c19 100 nf fig.11 test circuit of tda3681th. (1) a minimum capacitor of 220 nf on the supply lines v p1 and v p2 is required for stability. (2) a minimum capacitor of 1 m f for backup supply is required for stability. (3) capacitor represents the typical input capacitance of cmos logic connected to the reset and hold outputs. 2004 mar 31 21 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 application information n oise table 1 noise ?gures note 1. measured at a bandwidth of 30 khz. the noise on the supply line depends on the value of the supply capacitor and is caused by a current noise (the output noise of the regulators is translated to a current noise by the output capacitors). the noise is minimal when a high frequency capacitor of 220 nf in parallel with an electrolytic capacitor of 100 m f is connected directly to the supply pins v p1 , v p2 and gnd. s tability the regulators are stabilized by the externally connected output capacitors. the output capacitors can be selected by using the graphs given in figs 12 and 13. when an electrolytic capacitor is used, its temperature behaviour can cause oscillations at a low temperature. the two examples below show how an output capacitor value is selected. example 1 regulators 1, 3 and 4 are stabilized with an electrolytic output capacitor of 220 m f (esr = 0.15 w ). at t amb =- 30 c, the capacitor value is decreased to 73 m f and the esr is increased to 1.1 w . the regulator remains stable at t amb = - 30 c; see fig.12. example 2 regulator 2 is stabilized with a 10 m f electrolytic capacitor (esr = 3 w ). at t amb = - 30 c, the capacitor value is decreased to 3 m f and the esr is increased to 23.1 w . as can be seen from fig.13, the regulator will be unstable at t amb = - 30 c. solution to avoid problems with stability at low temperatures, the use of tantalum capacitors is recommended. use a tantalum capacitor of 10 m f or a larger electrolytic capacitor. regulator noise figure ( m v) (1) c o =10 m fc o =47 m fc o = 100 m f 1 170 110 110 2 440 240 190 3 120 100 80 4857055 handbook, halfpage 0 0.1 1 10 c ( m f) mgl912 stable region maximum esr 100 esr ( w ) 20 15 10 5 fig.12 curve for selecting the value of the output capacitor for regulators 1, 3 and 4. handbook, halfpage 2 - 2 0 0.22 110 c ( m f) mgl913 4 6 8 10 12 stable region maximum esr minimum esr 100 esr ( w ) 14 fig.13 curve for selecting the value of the output capacitor for regulator 2. 2004 mar 31 22 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 package outlines references outline version european projection issue date iec jedec jeita dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot243-3 0 5 10 mm scale d l e a c a 2 l 3 q w m b p 1 d d z e e x h 117 j e h non-concave 99-12-17 03-03-12 dbs17p: plastic dil-bent-sil power package; 17 leads (lead length 7.7 mm) sot243-3 view b : mounting base side m 2 e v m b unit a e 1 a 2 b p cd (1) e (1) z (1) de d h ll 3 m mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 v 0.6 12.2 11.8 1.27 e 2 5.08 2.4 1.6 e h 6 2.00 1.45 2.1 1.8 3.4 3.1 4.3 8.4 7.0 q j 0.25 w 0.03 x 2004 mar 31 23 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 references outline version european projection issue date 99-12-17 03-03-12 iec jedec jeita dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot475-1 0 5 10 mm scale d l e a c a 2 l 3 q w m b p 1 d d z e e x h 117 j e h non-concave dbs17p: plastic dil-bent-sil (special bent) power package; 17 leads (lead length 12 mm) sot475-1 view b : mounting base side m 2 e v m b unit a e 1 a 2 b p cd (1) e (1) z (1) de d h ll 3 m mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 v 0.8 12.2 11.8 1.27 e 2 5.08 2.4 1.6 e h 6 2.00 1.45 2.1 1.8 3.4 3.1 4.3 12.4 11.0 q j 0.4 w 0.03 x 2004 mar 31 24 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 unit a 4 (1) references outline version european projection issue date iec jedec jeita mm + 0.08 - 0.04 3.5 0.35 dimensions (mm are the original dimensions) notes 1. limits per individual lead. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot418-3 0 5 10 mm scale hsop20: plastic, heatsink small outline package; 20 leads; low stand-off height sot418-3 a max. detail x a 2 3.5 3.2 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.7 1.5 2.5 2.0 v 0.25 w 0.25 yz 8 0 q 0.07 x 0.03 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1.27 d (2) 16.0 15.8 e (2) 11.1 10.9 0.53 0.40 a 3 a 4 a 2 (a 3 ) l p q a q d y x h e e c v m a x a b p w m z d 1 d 2 e 2 e 1 e 20 11 1 10 pin 1 index 02-02-12 03-07-23 2004 mar 31 25 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. through-hole mount packages s oldering by dipping or by solder wave typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: below 225 c (snpb process) or below 245 c (pb-free process) C for all the bga, htsson..t and ssop-t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. 2004 mar 31 26 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 2004 mar 31 27 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. hot bar soldering or manual soldering is suitable for pmfp packages. 5. these transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the reflow oven. the package body peak temperature must be kept as low as possible. 6. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 8. wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10. hot bar or manual soldering is suitable for pmfp packages. 11. image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on flex foil. however, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. the appropriate soldering profile can be provided on request. mounting package (1) soldering method wave reflow (2) dipping through-hole mount cpga, hcpga suitable - suitable dbs, dip, hdip, rdbs, sdip, sil suitable (3) -- through-hole- surface mount pmfp (4) not suitable not suitable - surface mount bga, htsson..t (5) , lbga, lfbga, sqfp, ssop-t (5) , tfbga, uson, vfbga not suitable suitable - dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable (6) suitable - plcc (7) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (7)(8) suitable - ssop, tssop, vso, vssop not recommended (9) suitable - cwqccn..l (11) , pmfp (10) , wqccn32l (11) not suitable not suitable - 2004 mar 31 28 philips semiconductors product speci?cation multiple voltage regulator with switch and ignition buffer tda3681 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. ? koninklijke philips electronics n.v. 2004 sca76 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands r32/06/pp 29 date of release: 2004 mar 31 document order number: 9397 750 12427 |
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